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Patent # Description
US-1,071,6251 Component mounting robot system
A component mounting robot system includes a component transfer robot which transfers a mounting component including a mounting portion to a base component's...
US-1,071,6250 Component mounting apparatus
A component mounting apparatus is provided with a controller that controls a mounting head. The mounting head is provided with a nozzle holder, a nozzle that is...
US-1,071,6249 Component mounting machine
A component mounting machine is provided with a suction nozzle including a nozzle suction surface, a camera acquiring nozzle imaged data of a tip end of the...
US-1,071,6248 Component supply device
A component supply device is a device for supplying components housed in a component storage tape to a component extraction position. The component storage tape...
US-1,071,6247 Electromagnetic absorber
Provided is an electromagnetic-wave absorber that can favorably absorb electromagnetic waves of a plurality of different frequencies in a high frequency band...
US-1,071,6246 Thermal management device
A thermal management device for dissipating heat from one or more electrical components in an aircraft, the thermal management device including: a heat spreader...
US-1,071,6245 Provisioning cooling elements for chillerless data centers
Systems and methods for cooling include one or more computing structures, a heat rejection system configured to cool coolant, and one or more heat exchangers...
US-1,071,6244 Water cooled facilities and associated methods
The present disclosure provides facilities having water cooling subsystems and multi-lumen conduits coupled thereto. Also provided are methods of cooling...
US-1,071,6243 Use of Stirling engines for information processing system
An information processing system (TS) includes: a set of information processing devices forming a plurality of electrical circuits (C1, C2, C3 . . . Cn)...
US-1,071,6242 Data center modular systems
A modular data center system includes an upper module including a roller assembly attached to a frame of the upper module, the roller assembly configured to...
US-1,071,6241 Air flow distribution system for data center server racks
An air flow distribution system for cooling server racks includes at least one server rack partially defining a hot aisle and a cold aisle, a first air foil...
US-1,071,6240 Deflection of heated air from a posterior electrical component
Examples herein disclose a multi-channel apparatus include a first channel and a second channel. The first channel receives heated air from an electrical...
US-1,071,6239 Energy efficient data center liquid cooling with geothermal enhancement
A data center cooling system is operated in a first mode, has an indoor portion wherein heat is absorbed from components in the data center by a heat transfer...
US-1,071,6238 Device comprising heat producing components with liquid submersion cooling
A device comprising heat producing electronic components (2), such as server memory boards, processors and/or switches, said device comprising a container (1)...
US-1,071,6237 Device for driving motor
The present invention relates to a device for driving a motor, the device comprising: a main housing for accommodating a circuit module therein, wherein a top...
US-1,071,6236 Cooling a data center
Techniques for cooling a data center include circulating an airflow, to a warm air plenum of a first module, from rows of racks that support a heat-generating...
US-1,071,6235 Adjustable mounting rail latches
Presented herein are adjustable mounting rail latches that each comprise first and second latch modules. The latch modules each have a first side configured to...
US-1,071,6234 Method of installing a server rack in a data center
A server rack seismic restraint includes a rear restraint assembly configured to attach to a support surface that is operable to support a data center server...
US-1,071,6233 Server
According to an example, a server may include a housing including a bottom portion, a first node defined by first and second printed circuit assemblies, and a...
US-1,071,6232 Low profile, nesting capacitor collars
A mounting collar comprises a collar body comprising an opening for receiving at least a portion of an electronics component (e.g., capacitor) of an electronics...
US-1,071,6231 Pin count socket having reduced pin count and pattern transformation
An interposer and method of providing spatial and arrangement transformation are described. An electronic system has an electronic package, a motherboard and an...
US-1,071,6230 Waterproof electronic device and production method of waterproof electronic device
The first annular sealing material is filled and applied between a first sealing surface provided on an outer peripheral part of the case and a second sealing...
US-1,071,6229 Wireport assembly
An electrified wire containing a plurality of integrated hubs populated along the wire's span providing mechanical and electrical and data connectivity to an...
US-1,071,6228 Support mechanism and mobile terminal
A support mechanism and a mobile terminal are provided. The support mechanism comprises: a first support plate, a second support plate, and a transmission...
US-1,071,6227 Bending apparatus and display device
A bending apparatus and a display device are provided. The bending apparatus includes a first supporting portion, a second supporting portion and a bending...
US-1,071,6225 Data storage devices and connectors for same
A storage device includes a circuit board configured to store data and a connector mounted horizontally to the first surface of the circuit board. The connector...
US-1,071,6224 Field serviceable and replaceable assembly
A field serviceable and interchangeable display system and method is provided. A first and second side assembly are each selected from a number of: digital side...
US-1,071,6223 Frame assembly for an electronic device display
A display assembly includes an electronic display that comprises a collection of substrate layers and that has a first outline. The display assembly also...
US-1,071,6222 Laminate production method
Method of manufacturing laminate body by: curing thermosetting resin composition on a support; laminating the curable resin onto a substrate; heating the...
US-1,071,6221 Method of manufacturing electronic device
Provided is a method for manufacturing an electronic device. The method includes providing a panel to a stage, providing a circuit board, aligning the circuit...
US-1,071,6220 Variable temperature controlled soldering iron
A soldering iron system with automatic variable temperature control comprising a hand piece or robot arm including a soldering cartridge having a soldering tip,...
US-1,071,6219 Electronic product and manufacturing method thereof
A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a...
US-1,071,6218 Display device and method for manufacturing the same
A display device is provided with a laminated wiring including a low-resistance conductive film, a low-reflection film mainly containing Al and functioning as a...
US-1,071,6217 Poly-based burr suppressor
A burr-suppressing copper foils are described. In an embodiment, the burr suppressing copper foil includes a poly-based film having an adhesive on a first side...
US-1,071,6216 Pixelized thermal conductivity determination for printed circuit boards
Various aspects of the disclosed technology relate to pixel-based thermal conductivity determination. A pixelized representation is created for a conductor...
US-1,071,6215 Display device
A display device includes a display substrate with a display area, a first peripheral area, and a second peripheral area, the display area having first and...
US-1,071,6214 Hybrid microelectronic substrate and methods for fabricating the same
A hybrid microelectronic substrate may be formed by the incorporation of a high density microelectronic patch substrate within a lower density microelectronic...
US-1,071,6213 Direct connection of high speed signals on PCB chip
To eliminate signal loss and sources of signal attenuation, a connection methodology is utilized which enables high-speed signals to be directly communicated...
US-1,071,6212 LC device and method of manufacturing LC device
An inductor having an excellent Q values is provided with a configuration in which an inductor and a capacitor are integrally formed in a single element....
US-1,071,6211 Printed circuit board, printed wiring board, electronic device, and camera
A printed wiring board includes a plurality of first wirings and a plurality of second wirings. The plurality of first wirings each include a first via...
US-1,071,6210 Printed circuit board including through-hole vias
Various examples provide a printed circuit board (PCB) comprising a first route from a first through-hole via to a second through-hole via, and a second route...
US-1,071,6209 Fiber weave-sandwiched differential pair routing technique
To overcome the problem of the fiber weave effect desynchronizing differential signals in a pair of traces of approximately the same length in a printed circuit...
US-1,071,6208 Wiring board
A wiring board includes: a first insulating layer; a second insulating layer that is formed on an upper face of the first insulating layer; a first metal layer...
US-1,071,6207 Printed circuit board and integrated circuit package
An apparatus comprising a printed circuit board (PCB) that includes: a multilayer lamination of layers; vias on a surface of the PCB; and bonding pads that...
US-1,071,6206 Flexible printed circuit board return path design with aligned companion trace on ground plane
A flexible printed circuit board (PCB) includes a flexible first layer proximate to a flexible second layer. Conductive traces are arranged in the flexible...
US-1,071,6204 Keyboard
The present application discloses a keyboard, which includes a base plate and a thin film circuit board. The base plate includes a first part, a second part and...
US-1,071,6203 Adhesive film and flexible metal laminate
To provide an adhesive film comprising a polyimide film and a fluorinated resin layer directly laminated, in which blisters (foaming) in an atmosphere...
US-1,071,6202 Crosstalk mitigation for PCB to die transition in superconducting devices
The subject disclosure relates generally to a method of implementing magnetic shielding walls with specific respective dimensions to reduce crosstalk between...
US-1,071,6201 Component carrier and method to produce said component carrier
The invention relates to a component carrier for an electronic device, the component carrier comprising at least one heat-releasing component that is embedded...
US-1,071,6200 Plasma arc cutting system, including retaining caps, and other consumables, and related operational methods
A liquid cooled shield assembly for a plasma arc torch includes an inner cap and a shield. The inner cap includes a substantially hollow body having a proximal...
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